2-5

(竹北) 封裝新產品開發工程師

9/26/2025

As a new product development engineer at Winbond in Zhubei, you will ensure product reliability through laboratory analysis and assist customers in resolving issues. You will also help implement Winbond's quality standards and policies.

Working Hours

40 hours/week

Company Size

1,001-5,000 employees

Language

Chinese

Visa Sponsorship

About The Company

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

About the Role

作為華邦的(竹北) 封裝新產品開發工程師，你將透過實驗室分析確保產品可靠性，於第一線協助客戶解決問題外，也協助內外部單位落實華邦的品質指標及政策。工作內容包含：，以下為工作內容、工作條件以及重要通知。

【工作內容】
1.WLCSP / RDL / Package 新產品開發
2.建立SOP（標準作業程序），規格訂定與撰寫量產相關文件
3.新產品異常分析和改善，與外包廠商合作進行異常分析與改進

工作地點：竹北辦公室(新竹縣竹北市文興路二段539號)
聘僱性質：全職

【條件要求】

學歷要求：大學
科系要求：電機電子工程相關 │ 機械工程相關 │ 材料工程相關
相關經驗：3年以上
語言能力：英文中級 │ │
管理責任：No
輪班需求：No
出差需求：1個月以下
外派需求：No
其他條件：

1.熟悉封裝材料特性
2.IC封裝新產品開發相關經驗
3.熟悉DOE 流程
4.熟悉 DFEMA / PFEMA

#LI-LL1

Key Skills

WLCSPRDLPackage DevelopmentSOP CreationSpecification DevelopmentProduction DocumentationAnomaly AnalysisCollaboration with OutsourcingPackaging Material KnowledgeIC Packaging ExperienceDOE Process FamiliarityDFEMA KnowledgePFEMA Knowledge