5-10

(中科) NOR Flash 製程整合研發工程師

11/28/2025

As a NOR Flash Process Integration R&D Engineer at Winbond, you will engage with advanced process technologies during the product development phase. Responsibilities include developing advanced NOR flash processes, improving yield, and analyzing electrical anomalies.

Working Hours

40 hours/week

Company Size

1,001-5,000 employees

Language

Chinese

Visa Sponsorship

About The Company

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond's product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China, Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.

About the Role

【工作內容】
作為華邦的(中科) NOR Flash 製程整合研發工程師，你將於產品製程研發階段，接觸公司最先進的製程技術，工作內容包含：
(1) 先進製程 NOR flash 開發、製程調整與製程參數數據分析
(2) 製程/產品良率提昇、改善
(3) 產品電性異常/低良率產品分析與改善
(4) 基本元件特性分析、 SEM/TEM 剖面分析
(5) 製程可靠性改善、晶片層次製程可靠性分析

【條件要求】
學歷要求：碩士
科系要求：工程學科類(全部) │ │
相關經驗：不拘
語言能力：英文中級 │ │
管理責任：No
輪班需求：No
出差需求：無
外派需求：No
其他條件：
(1) 電子電機或理工學科相關科系碩士畢
(2) 3年以上半導體製程相關工作經驗 (具 NOR flash 開發經驗尤佳)
(3) 熟悉非揮發性記憶體技術或半導體物理基礎尤佳
(4) 具 flash 產品工程相關經驗尤佳
(5) 具實驗設計、數據分析、且曾有良率提升或是 Flash 可靠度問題的解決相關經驗或手法尤佳
(6) 具備power BI 規劃與python程式開發能力尤佳

Key Skills

NOR Flash DevelopmentProcess AdjustmentData AnalysisYield ImprovementElectrical AnalysisReliability ImprovementSEM AnalysisTEM AnalysisNon-Volatile Memory TechnologySemiconductor PhysicsFlash Product EngineeringExperimental DesignData AnalysisPower BIPython Programming