Engineer - Field Application

About Company:

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 200 campuses across 24 countries. In the US, Foxconn operates across 40 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas and California. As of 2023, Foxconn ranks 32^nd among the Fortune Global 500 and reported a revenue of approximately USD $213 billion in 2024.

The company’s diverse product offerings span four major segments: smart consumer electronics, cloud and networking solutions, computing and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together these initiatives position the company as a leader for innovation in the 21st century.  

Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods.

About the Role:

The Field Application Engineer - PCB plays a critical role in bridging the gap between product development and customer implementation by providing expert technical support and solutions tailored to client needs. This position involves working closely with customers to understand their technical requirements, troubleshoot issues, and optimize the use of our products in real-world applications. The engineer will collaborate with sales, product management, and engineering teams to ensure customer satisfaction and successful deployment of solutions. By delivering technical presentations, conducting product demonstrations, and offering training, the Field Application Engineer helps customers maximize the value of our technology. Ultimately, this role drives customer success and contributes to the continuous improvement of our products through direct feedback and technical insights.

Duties and Responsibilities:

• Provide application and product-level support to clients.
• Collaborate with customer engineering teams on integration, debugging, and performance optimization.
• Translate client technical requirements to internal R&D teams.
• Deliver technical training, product demos, and documentation to customers.
• Conduct failure analysis (FA) and root-cause investigation and recommend solutions.
• Drive product design development incorporating design rules, performance optimization and manufacturing for HVM (high volume manufacturing).
• Optimize testing processes and create reliable automated test programs.
• Collaborate cross-functionally with R&D, manufacturing, and quality teams to ensure products meet engineering specifications and customer expectations.
• Create field reports, support documentation, and provide feedback for continuous improvement.
• Leverage extensive personal experience in PCB design and material science to become a trusted partner for our customers.
• Stay updated on PCB technology trends and industry developments; propose recommendations to support product improvement and innovation.
• Perform other duties as requested or assigned.

Education:

• Bachelor’s degree or above in Electronic Engineering or a related field.

Experience:

• 3–5 years of experience in PCB design, manufacturing, or testing.
• Additional work experience should be related to the electronics industry, with a total of approximately 8 years of professional experience.
• Familiarity with Electronic Components such as 
  • PCB fundamentals: stack-up / bring-up / FR4 / Rogers / TH / micro-via / HASL / ENIG
  • High-Speed Signals / PI / EMC
  • Manufacturing and Assembly: SMT / BGA / reflow profile / AOI / X-ray
  • PCB-related tools: AutoCAD / Polar / SI9000 / Genesis / InFlow.
• Experience with Minitab and DOE methodologies is preferred.
• Proficient in Excel for data analysis

Other Requirements:

• Excellent communication and problem-solving skills, with the ability to collaborate effectively with customers and internal teams.
• Willingness to travel to customer sites to provide technical support.
• English and Mandarin speaking preferred.